Run - to -Run Control of ITO Deposition Process

Run by Run Advanced Process Control of Metal Sputter Deposition

Metal sputter deposition processes for semiconductor manufacturing are characterized by a decrease in deposition rate from run to run as the sputter target degrades. The goal is to maintain a desired deposition thickness from wafer to wafer and lot to lot. Run by run (RbR) model-based process control (MBPC) has been applied to metal sputter deposition processes at Texas Instruments. RbR MBPC, b...

Run-to-Run Control in Semiconductor Manufacturing

Run-to-run Optimization via Constraint Control

Run-to-run optimization methodologies exploit the repetitive nature of batch processes to find the optimal operating policy in the presence of uncertainty. For the class of batch optimization problems where the solution is determined by terminal constraints, the update of the decision variables towards their optimal values is realized using a constraint control scheme. The methodology is adapte...

Integrated model-based run-to-run uniformity control for epitaxial silicon deposition

Model - Based Run - to - Run Uniformity Control for Epitaxial Silicon Deposition ]

This paper analyzes data taken by Gower-Hall for his MIT PhD thesis. In his thesis, Gower-Hall examines run-to-run control of epitaxial film deposition by way of thickness and resistivity measurements of the film deposited. Our main focus is analysis of the resistivity data captured from the experiments. We give an overview of the thesis, confirm Gower-Hall’s findings of the main factors influe...